Through Silicon Vias: Materials, Models, Design, and PerformanceКНИГИ » АППАРАТУРА
Название: Through Silicon Vias: Materials, Models, Design, and Performance Автор: Brajesh Kumar Kaushik and Vobulapuram Ramesh Kumar Издательство: CRC Press Год: 2016 Формат: PDF Размер: 8 Мб Язык: английский / English
Recent advances in semiconductor technology offer vertical interconnect access (via) that extend through silicon, popularly known as through silicon via (TSV). This book provides a comprehensive review of the theory behind TSVs while covering most recent advancements in materials, models and designs. Furthermore, depending on the geometry and physical configurations, different electrical equivalent models for Cu, carbon nanotube (CNT) and graphene nanoribbon (GNR) based TSVs are presented. Based on the electrical equivalent models the performance comparison among the Cu, CNT and GNR based TSVs are also discussed.
Vertical GaN and SiC Power Devices Название: Vertical GaN and SiC Power Devices Автор: Kazuhiro Mochizuki Издательство: Artech House Год: 2018 Формат: PDF Размер: 2 Мб Язык:...
Nanoscale Silicon Devices Название: Nanoscale Silicon Devices Автор: Shunri Oda and David K. Ferry Издательство: CRC Press Год: 2016 Формат: PDF Размер: 25 Мб Язык:...
Nano-Semiconductors: Devices and Technology Название: Nano-Semiconductors: Devices and Technology Автор: Krzysztof Iniewski Издательство: CRC Press Год: 2011 Формат: PDF Размер: 12,8 Мб Язык:...
Навигация
Вход на сайт
Реклама
Through Silicon Vias: Materials, Models, Design, and Performance 
