3D IC and RF SiPs: Advanced Stacking and Planar Solutions for 5G MobilityКНИГИ » СЕТЕВЫЕ ТЕХНОЛОГИИ
Название: 3D IC and RF SiPs: Advanced Stacking and Planar Solutions for 5G Mobility Автор: Lih-Tyng Hwang, Tzyy-Sheng Jason Horng Издательство: Wiley Год: 2018 ISBN: 9781119289678 Формат: pdf Страниц: 464 Размер: 11,8 mb Язык: English
When the first cellular phone was demonstrated in 1973, it was the size of a brick. To put it more precisely, it weighed 2.5 pounds, was 9 inches long, 5 inches deep, and 1.75 inches wide. Now, a cellular phone can fit comfortably in the pocket; some of them are even smaller than the size of a palm. People travel with a personal mobile device, a smartphone, or an iPad, and make a phone call right through either a cellular based network or through a voice over IP (VoIP) access point nearby.
This book details miniaturization technology that has helped to realize this newly found human experience — mobility, an experience that may be as significant as the freedom discovered by homo erectus.
• Features an interdisciplinary approach to the enabling technologies and hardware for 3D ICs and 5G mobility • Presents statistical treatments and examples with tools that are easily accessible, such as Microsoft’s Excel and Minitab • Fundamental design topics such as electromagnetic design for logic and RF/passives centric circuits are explained in detail • Provides chapter-wise review questions and powerpoint slides as teaching tools
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3D IC and RF SiPs: Advanced Stacking and Planar Solutions for 5G Mobility 
