Robust Design of Microelectronics Assemblies Against Mechanical Shock, Temperature and MoistureКНИГИ » ТЕХНИЧЕСКИЕ НАУКИ
Название: Robust Design of Microelectronics Assemblies Against Mechanical Shock, Temperature and Moisture Автор: E.-H. Wong and Y.-W. Mai Издательство: Woodhead Publishing Год: 2015 Формат: PDF Страниц: 477 Для сайта:Mirknig.su Размер: 25,44 MB Язык: English
Robust Design of Microelectronics Assemblies Against Mechanical Shock, Temperature and Moisture discusses how the reliability of packaging components is a prime concern to electronics manufacturers. The text presents a thorough review of this important field of research, providing users with a practical guide that discusses theoretical aspects, experimental results, and modeling techniques. The authors use their extensive experience to produce detailed chapters covering temperature, moisture, and mechanical shock induced failure, adhesive interconnects, and viscoelasticity. Useful program files and macros are also included.
Discusses how the reliability of packaging components is a prime concern to electronics manufacturers Presents a thorough review of this important field of research, providing users with a practical guide that discusses theoretical aspects, experimental results, and modeling techniques Includes program files and macros for additional study
Vibration and Shock Handbook Название: Vibration and Shock Handbook Автор: Edited by Clarence W. de Silva Издательство: Taylor & Francis Group Год: 2005 Формат: PDF Страниц:...
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Robust Design of Microelectronics Assemblies Against Mechanical Shock, Temperature and Moisture 
