Modeling, Analysis, Design, and Tests for Electronics Packaging beyond Moore)КНИГИ » АППАРАТУРА
Название: Modeling, Analysis, Design, and Tests for Electronics Packaging beyond Moore Автор: Hengyun Zhang, Faxing Che Издательство: Woodhead Publishing Год: 2020 Страниц: 427 Язык: английский Формат: pdf (true) Размер: 25.2 MB
Modeling, Analysis, Design and Testing for Electronics Packaging Beyond Moore provides an overview of electrical, thermal and thermomechanical modeling, analysis, design and testing for 2.5D/3D. The book addresses important topics, including electrically and thermally induced issues, such as EMI and thermal issues, which are crucial to package signal and thermal integrity. It also covers modeling methods to address thermomechanical stress related to the package structural integrity. In addition, practical design and test techniques for packages and systems are included.
Key Features Includes advanced modeling and analysis methods and techniques for state-of-the art electronics packaging Features experimental characterization and qualifications for the analysis and verification of electronic packaging design Provides multiphysics modeling and analysis techniques of electronic packaging
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Modeling, Analysis, Design, and Tests for Electronics Packaging beyond Moore) 
