SiP System-in-Package Design and Simulation: Mentor EE Flow Advanced Design GuideКНИГИ » ТЕХНИЧЕСКИЕ НАУКИ
Название: SiP System-in-Package Design and Simulation: Mentor EE Flow Advanced Design Guide Автор: Suny Li (Li Yang) Издательство: Wiley Год: 2017 Формат: PDF Размер: 88 Мб Язык: английский / English
Written by an engineer at the leading edge of SiP design and implementation, this book demonstrates how to design SiPs using Mentor EE Flow. Key topics covered include wire bonding, die stacks, cavity, flip chip and RDL (redistribution layer), Embedded Passive, RF design, concurrent design, Xtreme design, 3D real-time DRC (design rule checking), and SiP manufacture.
Extensively illustrated throughout, System in Package Design and Simulation covers an array of issues of vital concern for SiP design and fabrication electronics engineers, as well as SiP users, including:
Cavity and sacked dies design FlipChip and RDL design Routing and coppering 3D Real-Time DRC check SiP simulation technology Mentor SiP Design and Simulation Platform
Designed to function equally well as a reference, tutorial, and self-study, System in Package Design and Simulation is an indispensable working resource for every SiP designer, especially those who use Mentor design tools.
Intelligent Control Design and MatLab Simulation Название: Intelligent Control Design and MatLab Simulation Автор: Jinkun Liu Издательство: Springer Год: 2018 Формат: PDF Страниц: 298 Размер: 5 MB...
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SiP System-in-Package Design and Simulation: Mentor EE Flow Advanced Design Guide 
